Jobs / Summary

Team Lead in Semiconductor Packaging for Co-Packaged Optics

Confidential company · Stuttgart · Posted Jun 29, 2026

Public summary

A technology company developing next-generation photonic processing systems is seeking a Team Lead for their Co-Packaged Optics (CPO) packaging team. This leadership position involves building and scaling a new high-performance engineering team, overseeing global OSAT supplier evaluation and onboarding, and driving the transition of advanced photonic/electronic assemblies from concept to volume production. Candidates should have extensive semiconductor packaging experience, hands-on skills with CPO and optical fiber attachment, and strong leadership capabilities. Fluency in English is required; German language skills are considered beneficial. The role is based in Stuttgart, Germany within a cutting-edge deep-tech environment focused on photonic computing solutions.

Location and work setup

Location
Stuttgart
Remote status
On-site
German requirement signal
Unclear
Detected job language
English

Responsibilities

Lead the establishment and growth of a Co-Packaged Optics packaging engineering team; conduct gap analyses and strategic hiring. Manage the evaluation, qualification, and technical oversight of global OSAT partners, ensuring onboarding of qualified suppliers. Take full technical ownership of advanced co-packaged photonic/electronic assemblies including optical fiber coupling and thermal management. Implement and enforce Design for Manufacturability guidelines and ensure reliability qualifications under JEDEC and Telcordia standards. Serve as liaison between chip design, systems, manufacturing, testing, and supply chain teams to ensure smooth new product introduction and production scale-up. Apply structured root cause analysis methodologies to resolve reliability and process deviations promptly.

Qualifications

Bachelor's or Master's degree in Electrical Engineering, Materials Science, Physics, or related technical field. Minimum of 5 years experience in semiconductor packaging within Back-End or OSAT environments, with proven global supplier evaluation expertise. Direct hands-on experience with Co-Packaged Optics packaging and optical fiber attachment technologies. Demonstrated success in leadership roles involving team building and scaling, fostering high performance and accountability. Strong analytical and self-management skills in fast-paced innovative settings. Excellent written and verbal English communication skills; proficiency in German and experience with glass substrates is advantageous.

Skills

Team Leadership OSAT Supplier Evaluation Co-Packaged Optics Packaging Optical Fiber Attachment Advanced Packaging Materials Thermal Management Design for Manufacturability (DFM) Root Cause Analysis 8D Problem Solving FMEA Ishikawa Diagrams Cross-Functional Collaboration English Communication German (advantageous)