Public summary
A deep-tech company in Stuttgart, Germany, is seeking a Senior Integrated Photonics Packaging Engineer to lead the development and transition of photonic computing technology from prototypes to high-performance, miniaturized photonic modules. The role focuses on RF and electro-optical packaging, involving design, verification, supplier management, and innovative packaging solutions to support next-generation AI and high-performance computing applications.
Location and work setup
- Location
- Stuttgart
- Remote status
- On-site
- German requirement signal
- No German Required Detected
- Detected job language
- English
Responsibilities
Define and lead development of high-density electro-optical and RF packaging solutions ensuring superior signal and power integrity. Drive supplier-managed R&D packaging projects from specifications through system integration and validation. Perform electromagnetic modeling, co-simulation, and apply transmission line theory, EMC shielding. Manage PCB and package layouts using advanced materials (HTCC, LTCC, HDI). Implement thermal management strategies for high-power photonic and high-frequency devices. Establish quality assurance protocols to ensure high first-pass qualification rates. Innovate annually by introducing new packaging materials, processes, or architectures. Collaborate with R&D, manufacturing, systems, and test teams to align packaging solutions with system architecture.
Qualifications
Master’s or PhD in Electrical Engineering, Photonics, Optoelectronics, Physics, or related field, or equivalent industry experience. 5+ years hands-on experience in RF packaging, optoelectronic integration, or high-density interconnect technologies. Proven track record managing supplier-led R&D projects from definition to integration and validation. Deep expertise in RF signal/power integrity, electromagnetic simulation tools, S-parameter measurements, and EMC shielding. Strong background in semiconductor backend integration, thermal management, advanced packaging substrates (HTCC, LTCC, HDI). Experience with CAD tools for electronic packaging, statistical process control, and industry standards (Telcordia, JEDEC). Fluent in English; German or other European languages are a plus. Solution-oriented with attention to detail, ownership, self-leadership, and excellent cross-functional communication skills.