Public summary
Seeking a Senior Integrated Photonics Packaging Engineer to lead optical packaging architecture and high-density packaging solutions for advanced photonic processing systems. The role involves managing supplier-driven R&D projects, innovating optical coupling and thermal management strategies, and collaborating across R&D, manufacturing, and test teams to advance AI computing infrastructure based on photonic integrated circuits. Requires a MSc or PhD in Photonics, Electrical Engineering, Physics, or related field, with 5+ years of relevant experience and fluency in English.
Location and work setup
- Location
- Stuttgart
- Remote status
- On-site
- German requirement signal
- No German Required Detected
- Detected job language
- English
Responsibilities
Define and own optical packaging architecture and high-density solutions; lead supplier-driven R&D projects from requirements to system integration; develop advanced optical coupling and thermal management methods; drive design for manufacturability and material selection; conduct root-cause analysis on integration failures; implement novel packaging concepts annually; collaborate with internal R&D, manufacturing, and test teams to align packaging with overall product architecture.
Qualifications
MSc or PhD in Photonics, Optoelectronics, Electrical Engineering, Physics, or related field, or equivalent industry experience; over 5 years of hands-on experience in photonics packaging or related fields; proven experience managing supplier-led R&D projects; strong knowledge of PICs, laser sources, photodetectors, analog electronics, and semiconductor back-end integration; expertise in optical coupling techniques, thermal management, and design for manufacturability; proficiency with optical design tools such as Zemax or CODE V; experienced with root-cause analysis methodologies; fluent in English; knowledge of German or other European languages is a plus.