Public summary
We are seeking a Senior Engineer specializing in MEMS Assembly to join a precision timing semiconductor company in Germany. The role involves developing, evolving, and troubleshooting MEMS wafer-level packaging technologies in collaboration with assembly partners and internal design teams. The ideal candidate holds an MS or PhD in Mechanical Engineering, Electrical Engineering, Physics, or equivalent, with at least 5 years of industrial experience in MEMS assembly and packaging. This position offers a comprehensive compensation package including base salary, quarterly innovation bonuses, and equity grants, within an equal opportunity work environment.
Location and work setup
- Location
- Munich
- Remote status
- On-site
- German requirement signal
- No German Required Detected
- Detected job language
- English
Responsibilities
Manage and collaborate with MEMS back-end assembly and packaging partners to develop advanced MEMS wafer-level packaging technologies; evaluate assembly process impacts on device performance and reliability to ensure high yield and quality; work closely with MEMS design and characterization teams to guarantee manufacturability and validation; coordinate and perform failure analysis to identify and resolve assembly process issues; define next-generation packaging technologies to support breakthrough timing products.
Qualifications
MS or PhD in Mechanical Engineering, Electrical Engineering, Physics, or equivalent; minimum 5 years industrial experience in MEMS assembly and packaging; strong understanding of MEMS design and interactions between design, fabrication, and packaging; experience with reliability characterization and yield analysis; preferred experience bringing MEMS products to production; strong organizational skills, initiative, critical thinking, experimental design and result interpretation; excellent scientific communication; ability to work collaboratively in a fast-paced team environment.