Public summary
Join a high-tech company pioneering laser communication technology by designing complex high-speed electronics boards for optical communication terminals. The role involves schematic capture, PCB layout, simulation analyses, collaboration with manufacturing partners, and lab testing to ensure product quality and performance. This position requires significant experience in electrical engineering with a focus on multilayer high-speed PCB development using advanced FPGA technologies.
Location and work setup
- Location
- Munich
- Remote status
- On-site
- German requirement signal
- No German Required Detected
- Detected job language
- English
Responsibilities
Design and layout complex high-speed multilayer PCBs hosting advanced FPGA and SoC devices. Define design constraints and adhere to vendor guidelines for fan-out, stack-up, power delivery, and high-speed serial interfaces. Perform signal integrity, power integrity, and thermal simulations. Coordinate with mechanical and thermal teams to finalize designs. Interface with PCB manufacturers to ensure design for manufacturing and fabrication standards. Bring up, test, debug boards in the lab and verify against specifications. Prepare design documentation and support design reviews and production handover.
Qualifications
Bachelor's or Master's degree in Electrical Engineering or related field. At least six years of hands-on experience designing complex multilayer high-speed PCBs, preferably involving FPGA/BGA components. Proficient with Altium Designer for schematic capture and PCB layout. Strong expertise in high-speed design principles including controlled impedance, multi-gigabit SerDes, DDR memory interfaces, and power distribution networks. Experience with signal and power integrity simulation tools and practical lab debugging skills. Familiarity with aerospace, defense, or space-related standards and IPC standards is advantageous. Commitment to high quality and practical problem-solving mindset.